I/o module

ABSTRACT

An I/O module includes a base plate, a plurality of universal circuits, and an option module. The base plate includes a plurality of connection terminals. A plurality of field devices is electrically connectable to the connection terminals. The universal circuits correspond to the connection terminals. The universal circuits are provided on the base plate, and configured to perform an input of analog signals from the field device, an output of analog signals to the field device, an input of discrete signals from the field device, and an output of discrete signals to the field device. The option module is detachably provided in the base plate. The option module is provided between a first connection terminal of the connection terminals and a first universal circuit of the universal circuits. The option module includes a first circuit configured to performing transmitting and receiving of signals between the first connection terminal and the first universal circuit. The first connection terminal corresponds to the first universal circuit.

CROSS REFERENCES TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.14/525,770 filed on Oct. 28, 2014, which is based on and claims priorityof Japanese patent application 2013-226263, filed on Oct. 31, 2013, thecontents of these applications are incorporated herein by reference intheir entirety.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to an I/O module.

Priority is claimed on Japanese Patent Application No. 2013-226263,filed Oct. 31, 2013, the contents of which are incorporated herein byreference.

Description of Related Art

In a plant or a factory or the like, a process control systemcontrolling various state quantities (for example, pressure,temperature, and flow rate) in an industrial process has been built, anda high level of automated execution has been implemented. In such aprocess control system, generally, on-site devices called field devices(measuring devices, and actuators) are connected to a controller via anI/O module. The controller controls an actuator based on measuredresults of a measuring device (for example, sensor) to control thevarious state quantities.

There are various field devices used for the process control systemdepending on measuring targets and operation targets. The form ofsignals input to and output from the field devices also varies. Forexample, there are a field device for performing input and output of ananalog signal, which is “4 to 20 mA” and the like, a field device forperforming input and output of a discrete signal, which is “24V”, afield device for performing input and output of a contact signal, and afield device for performing output of a thermocouple signal. Therefore,an I/O circuit is provided for each field device depending on the typeof field device in the process control system in the related art.

The number of the I/O circuits provided in the process control systemincreases and decreases depending on the scale of the plant and thelike, and there are some cases where the number is over ten thousand ina large scale plant and the like. Therefore, even if the cost of thesingle I/O circuit is not so high, there are some cases where the totalcost of the I/O circuits in the overall process control system isconsiderably high. Therefore, it is necessary to decrease the number ofthe I/O circuits to reduce the cost.

U.S. Pat. No. 8,392,626 discloses a circuit (hereinafter, referred to asa universal circuit) capable of connecting a field device for performinginput and output of the analog circuit and the digital circuit, whichoccupies a majority of field devices. Specifically, the universalcircuit disclosed in U.S. Pat. No. 8,392,626 is capable of performingthe input of the analog signal, the output of the analog signal, theinput of the discrete signal, and the output of the discrete signal.When an I/O module (hereinafter, referred to as a universal I/O module)including a plurality of universal circuits described above is used, thenumber of type of field device connectable to a plurality of channels ofone universal I/O module can be increased compared to the case in whichan I/O module depending on the type of the field device is provided foreach channel. Therefore, a reduction of cost is expected.

When the universal I/O module, to which the majority of field devicesare connectable, is used, it is possible to decrease the total number ofthe I/O modules. Therefore, it is considered that a reduction of cost ispossible. However, depending on the type of field device, there arestill field devices which are incompatible with the universal I/Omodule.

For example, a field device for preforming a communication via aFoundation Fieldbus (registered trademark) does not merely transmitprocess values or receive parameters and is necessary to performprotocol processing. Therefore, when such field devices are connected tothe universal I/O module, there are some cases where the complexity ofthe circuit increases, and the area, the cost, the consumed power, andthe like increase. In addition, for example, in the case of a fielddevice outputting thermocouple signals, since the voltage of thethermocouple signal is too low, the field device cannot be connected tothe universal I/O module. Therefore, a dedicated I/O module compatiblewith low voltage is necessary. When such dedicated I/O module is added,the total number and the cost of the I/O modules increase.

SUMMARY OF THE INVENTION

One aspect of the present invention provides an I/O module, to whichmore multiple types of field devices than ever before are connectable.

An I/O module according to one aspect of present invention may include abase plate, a plurality of universal circuits, and an option module. Thebase plate may include a plurality of connection terminals. A pluralityof field devices may be electrically connectable to the connectionterminals. The universal circuits may correspond to the connectionterminals. The universal circuits may be provided on the base plate, andconfigured to perform an input of analog signals from the field device,an output of analog signals to the field device, an input of discretesignals from the field device, and an output of discrete signals to thefield device. The option module may be detachably provided in the baseplate. The option module may be provided between a first connectionterminal of the connection terminals and a first universal circuit ofthe universal circuits. The option module may include a first circuitconfigured to performing transmitting and receiving of signals betweenthe first connection terminal and the first universal circuit. The firstconnection terminal may correspond to the first universal circuit.

In the I/O module described above, the first circuit may include aconnection line electrically connecting the first connection terminaland the first universal circuit.

In the I/O module described above, the first circuit may be configuredto connect the first connection terminal and the first universal circuitto enable transmitting and receiving of signals between the firstconnection terminal and the first universal circuit while electricallyinsulating a connection between the first connection terminal and thefirst universal circuit.

In the I/O module described above, the first circuit may include aphotocoupler.

In the I/O module described above, the first circuit may be configuredto amplify or attenuate signals transmitted and received between thefirst connection terminal and the first universal circuit.

In the I/O module described above, the base plate may further include asignal processing circuit connected to the universal circuits andconfigured to process signals transmitted to and received from the fielddevice. The option module may be connected to the first universalcircuit and the signal processing circuit.

In the I/O module described above, the base plate may further include acommunication bus configured to connect the attached option module andthe signal processing circuit. The option module may be connected to thesignal processing circuit via the communication bus. The first circuitmay be configured to communicate with the signal processing circuit viathe communication bus.

In the I/O module described above, the option module may further includean identification circuit configured to identify the type of the optionmodule. The base plate may further include a signal processing circuit.The signal processing circuit may be connected to the universal circuitsand be configured to process signals transmitted to and received fromthe field device. The base plate may further include an identificationline. The identification line may be configured to connect theidentification circuit provided in the attached option module and thesignal processing circuit. The signal processing circuit may beconfigured to identify the type of option module attached to the baseplate based on signals at the identification line.

In the I/O module described above, the universal circuits may beinstalled on an universal I/O module detachably provided in the baseplate.

In the I/O module described above, the signal processing circuit and theuniversal circuits may be installed on an universal I/O moduledetachably provided on the base plate.

In the I/O module described above, at least two of the option modulesattached to the base plate may be same each other. The two optionmodules may be connected to one of the field devices to make the optionmodule redundant.

In the I/O module described above, the first circuit may include a firstinsulated circuit, a second insulated circuit, and a microprocessorconnected to the connection terminals and the first and second insulatedcircuits.

In the I/O module described above, the first insulated circuit may beconfigured to connect the microprocessor and the signal processingcircuit to enable transmitting and receiving of signals between themicroprocessor and the signal processing circuit while electricallyinsulating a connection between the microprocessor and the signalprocessing circuit.

In the I/O module described above, the second insulated circuit may beconfigured to convert a source voltage of system power source into asource voltage suitable for the microprocessor while electricallyinsulating a connection between the microprocessor and the system powersource.

In the I/O module described above, the microprocessor may be configuredto perform a conversion process of communication protocol for signalsinput from the field device via the connection terminal, and to outputthe processed signals to the first insulated circuit.

In the I/O module described above, the microprocessor may be configuredto perform at least one of an analog-to digital conversion process, acompensation process, and an amplification process for signals inputfrom the field device via the connection terminal, and to output theprocessed signals into the first insulated circuit.

According to one aspect of the present invention, any one of a pluralityof connection terminals provided on the base plate and the universalcircuit corresponding to the one connection terminal are connected bythe option module attached to the base plate, and the field deviceconnected to the one connection terminal and the universal circuit areelectrically connected by the first circuit provided in the optionmodule attached to the base plate. Therefore, the one aspect of thepresent invention allows for the connection of more types of fielddevices than ever before.

According to another aspect of the present invention, in addition to thesignal processing circuit connected to a plurality of universal circuitsand processing signals transmitted to and received from the fielddevice, the communication bus connecting the option module and thesignal processing circuit are also provided in the base plate. Thereby,another aspect of the present invention allows for the connection withthe field device without the universal circuit, and the connection ofmultiple types of field devices.

According to one aspect of the present invention, the identificationcircuit for identifying the type of the option module is provided in theoption module. Therefore, another aspect of the present invention allowsfor the selection and automatic setting of the universal circuit and thesignal processing circuit.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram showing an example of the overall constitutionof a process control system using an I/O module according to anembodiment of the present invention.

FIG. 2 is a perspective diagram showing the outer appearance of the I/Omodule according to the embodiment of the present invention.

FIG. 3 is a front diagram showing a base plate included in the I/Omodule according to the embodiment of the present invention.

FIG. 4A is a diagram showing an example of an internal circuit of anoption module used for the I/O module according to the embodiment of thepresent invention.

FIG. 4B is a diagram showing an example of an internal circuit of anoption module used for the I/O module according to the embodiment of thepresent invention.

FIG. 5A is a diagram showing an example of an internal circuit of anoption module used for the I/O module according to the embodiment of thepresent invention.

FIG. 5B is a diagram showing an example of an internal circuit of anoption module used for the I/O module according to the embodiment of thepresent invention.

FIG. 6 is a block diagram showing the internal constitution of auniversal I/O module used for the I/O module according to the embodimentof the present invention.

FIG. 7 is a block diagram simply showing a variation of the I/O moduleaccording to the embodiment of the present invention.

FIG. 8 is a diagram simply showing another variation of the I/O moduleaccording to the embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, an I/O module according to an embodiment of the presentinvention will be described in detail, with references made to thedrawings.

[Process Control System]

FIG. 1 is a block diagram showing an example of the overall constitutionof a process control system using an I/O module according to anembodiment of the present invention. A process control system 1 shown inFIG. 1 includes a plurality of field devices 11, an I/O module 12, acontroller 13, and a monitoring device 14. The controller 13 controlsthe field device 11 via the I/O module 12 under the monitoring of themonitoring device 14 to control an industrial process implemented in aplant or a factory or the like.

A plurality of I/O modules 12, to which a plurality of field devices 11is connected, is connected to the controller 13. In order to simplifythe drawing, only one I/O module 12 is shown in FIG. 1. A lineconcentration device referred to as a junction box or a marshaling maybe provided between the field device 11 and the I/O module 12.

The field device 11 is installed on site, for example, a plant or afactory, and performs at least one of measuring and operation of atarget required for the control of an industrial process. Specifically,the field device 11 includes, for example, a sensor device such as aflow gauge or temperature sensor, a valve device such as a flow ratecontrol valve or open and close value, an actuator device such as a fanor motor, an imaging device such as a camera or video for taking animage of a target or the situation in a plant, an acoustic device suchas a microphone or speaker for collecting abnormal noise or the like ina plant or emitting a warning sound or the like, a position detectiondevice for outputting position information of each device, and otherdevices.

The I/O module 12 is provided between the field device 11 and thecontroller 13. The plurality of field devices 11 is connectable to theI/O module 12. The I/O module 12 is for processing signals input andoutput between the connected field device 11 and the controller 13. Itmay be said that the I/O module 12 is for connecting the plurality offield devices 11 to the controller 13, and is for relaying signalsoutput from the field devices 11 to the controller 13 and signals outputfrom the controller 13 to the field devices 11. The details of the I/Omodule 12 will be described later

The controller 13 controls the field device 11 under the monitoring ofthe monitoring device 14. Specifically, the controller 13 collectsmeasured data from one field device 11 (for example, sensor device),calculates control data for controlling the field device 11 (forexample, valve device), and send the control data to another fielddevice 11 (for example, valve device).

The monitoring device 14 is operated by an operator in, for example, aplant, and is used for the monitoring of the process. Specifically, themonitoring device 14 acquires the input and output data of the fielddevice 11 from the controller 13 and displays the data. The monitoringdevice 14 operates the field device 11 based on the instructions inputby the operator as needed.

[I/O Module]

FIG. 2 is a perspective diagram showing the outer appearance of the I/Omodule according to the embodiment of the present invention. As shown inFIG. 2, the I/O module 12 includes a base plate BP, an option module M1,and a universal I/O module M2. In the I/O module 12 shown in FIG. 2,sixteen option modules M1 and two universal I/O modules M2 areattachable to the base plate BP. The maximum number of the optionmodules M1, which are attachable to the base plate BP, may be fewer orgreater sixteen. One universal I/O module, or universal I/O modulesequal to or greater than three may be attached to the base plate BP.

The option module M1 and the universal I/O module M2 are attached to thebase plate BP. The base plate BP is a back board of rectangular plate.In the base plate BP, for example, lines, which electrically connect theoption module M1 and the universal I/O module M2, are formed. FIG. 3 isa front diagram showing a base plate included in the I/O moduleaccording to the embodiment of the present invention. As shown in FIG.3, the base plate BP includes sixteen option slots SL1 (first slot), twouniversal-slots SL2 (second slot), a plurality of connection terminalsT1, an I/O bus connection terminal T2, an external power sourceconnection terminal T3, a system power source connection terminal T4,and a ground connection terminal T5, and the like.

The option module M1 is attached to the option slot SL1. The optionslots SL1 are arranged along the longitudinal direction of the baseplate BP between the universal-slots SL2 and the connection terminalsT1. Not shown in the figure, the configurations of terminals provided inthe option slots SL1 (the terminal connected to a terminal of optionmodule M1) are same each other for all of the option slots SL1. Thisenables an arbitrary option module M1 to be attached to an arbitraryoption slot SL1.

The universal I/O module M2 is attached to the universal-slot SL2. Thetwo universal-slots SL2 are arranged along to the short direction of thebase plate BP. Each of the two universal-slots SL2 is arranged on oneside of the option slot SL1 along to the longitudinal direction of thebase plate BP. Specifically, the option slot SL1 includes a first sideand a second side, which is opposite to the first side, along to thelongitudinal direction of the base plate BP. The universal-slots SL2 isarranged on the first side, while the connection terminal T1 is arrangedon the second side. As with the case of the option slots SL1, theconfiguration of terminal provided in one universal-slot SL2 (theterminal connected to a terminal of universal I/O module M2) is same asthat of the other universal-slot SL2.

Each option slot SL1 is electrically connected to both twouniversal-slots SL2. Since the figure would be complex when all of thelines, which connect the option slot SL1 and the universal-slot SL2, areshown, the line, which connects the option slot SL1 and theuniversal-slot SL2, is shown in FIG. 3 as a line L. The details of theline, which connects the option slot SL1 (the option module M1) and theuniversal-slot SL2 (the universal I/O module M2), will be describedlater.

The field device 11 is connected to the connection terminal T1. Eachconnection terminal T1 is provided to correspond to each option slot SL1(in other words, the option slot SL1 is provided to correspond to theconnection terminal T1). An example, in which the total number of theconnection terminals T1 provided in the base plate BP is 64 and fourconnection terminals T1 for each option slot SL1 are provided, is shownin FIG. 3. Sixteen field devices 11, the number of which is equal tothat of the option modules SL1, are attachable to the base plate BPshown in FIG. 3. In FIG. 3, in order to avoid the figure beingcomplicated, a line provided in the base plate BP, which connects theoption slot SL1 and the connection terminal T1 is also omitted.

The I/O bus connection terminal T2 is for connecting the universal-slotSL2 to an external I/O bus (the controller 13 is connected to the bus).In FIG. 3, in order to avoid the figure being complicated, a lineprovided in the base plate BP, which connects the universal-slot SL2 andthe I/O bus connection terminal T2, is also omitted. An external powersource and a system power source, which supply electrical power requiredfor the operations of the I/O module 12, are connected to the externalpower source connection terminal T3 and the system power sourceconnection terminal T4, respectively. The ground connection terminal T5is connected to a ground, which defines the reference potential of theI/O module 12.

The option module M1 is detachably provided to the option slot SL1provided in the base plate BP. The option module M1 enables variousfield devices 11 to be connected to the universal I/O module M2. Theoption module M1 has a cuboid shape. A circuit required to connect thefield device 11 to the universal I/O module M2 is provided in theinternal of option module M1.

The option module M1 has a constant configuration regardless of the kindof circuit provided thereinside. The configuration of a terminal (theterminal connected to the terminal of option slot SL1), which is notshown in the figure and provided in each option module M1, is same forthe option modules M1. This enables an arbitrary option module M1 to beconnected to an arbitrary option slot SL1.

FIGS. 4A, 4B, 5A and 5B are diagrams showing an example of an internalcircuit of an option module used for the I/O module according to theembodiment of the present invention. FIGS. 4A and 4B are diagramsshowing an example of an internal circuit of an option module notincluding a microprocessor, while FIGS. 5A and 5B are diagrams showingan example of an internal circuit of an option module including amicroprocessor. Hereinafter, first, the common constitution of theoption module M1 will be described, then, the specific constitutiondepending on the kind of option module M1 will be described.

As shown in FIGS. 4A, 4B, 5A and 5B, the option module M1 includes fourterminals T11 to T14 connected to the connection terminal T1 provided inthe base plate BP, and four terminals T21 to T24 connected to theuniversal I/O module M2. As shown in FIGS. 4A and 4B, and 5A and 5B, theconnection terminals T1, which are connected to the four terminals T11,T12, T13, and T14 of the option modules M1, are referred to asconnection terminals TA, TB, TC, and TD, respectively.

As shown in FIGS. 4A, 4B, 5A and 5B, a connection line L1, a connectionline L2, a status line ST (identification line), and a communication busSB performing a serial communication are connected to the four terminalsT21, T22, T23, and T24 of the option modules M1, respectively. Theselines connect the option slot SL1 and the universal I/O module M2. Thecommunication bus SB may be a dedicated serial bus or a versatile serialbus.

As shown in FIGS. 4A, 4B, 5A and 5B, the option module M1 includes anidentification resistance R (identification circuit) for identifying thekind of module itself. The identification resistance R has differentresistance value in each option module M1. One end of the identificationresistance R is connected to the terminal T23 (the terminal connected tothe status line ST), and the other end of the identification resistanceR is grounded. The identification resistance R is used when a signalprocessing circuit 22 provided in the universal I/O module M2 (refer toFIG. 6; the details of the signal processing circuit 22 will bedescribed later) identifies the option module M1.

The option module M1 shown in FIG. 4A is one, to which a valve device 11a is connected. A circuit C10 (first circuit), which includes aconnection line connecting the terminal T11 and the terminal T21 and aconnection line connecting the terminal T12 and the terminal T22, isprovided in the option module M1 shown in FIG. 4A. The valve device 11 ais connected to the connection terminals TA and TB. Therefore, it may besaid that the circuit C10 provided in the option module M1 shown in FIG.4A is for electrically connecting the valve device 11 a to theconnection lines L1 and L2. In FIG. 4A, the example in which the valvedevice 11 a is connected to the option module M1 was described. However,a transmitter, which outputs a signal of “4 to 20 mA”, or a contactswitch or the like may be connected to the option module M1.

The option module M1 shown in FIG. 4B is one, to which, a field device(electromagnetic valve) 11 b including a solenoid for driving, forexample, an actuator is connected. The option module M1 shown in FIG. 4Bincludes an insulated circuit C20 (first circuit) and an external powersource connection terminal T30. The insulated circuit C20 includes, forexample, a photocoupler or a trance. The insulated circuit C20 enablesthe transmitting and receiving of signals between the terminal T11 andthe terminal T21 and between the terminal T12 and the terminal T22 whileelectrically insulating the connection between the terminal T11 and theterminal T21 and electrically insulating the connection between theterminal T12 and the terminal T22. In detail, when the insulated circuitC20 includes a trance, the terminal T11 and the terminal T21 areelectrically conductive in an alternate current to each other, but areelectrically insulated in a direct current to each other. The terminalT12 and the terminal T22 are electrically conductive in an alternatecurrent to each other, but are electrically insulated in a directcurrent to each other. The transmitting and receiving of signals betweenthe terminal T11 and the terminal T21 and between the terminal T12 andthe terminal T22 are executed.

The external power source connection terminal T30 is for connecting anexternal power source (the external power source connected to theexternal power source connection terminal T3 shown in FIGS. 2 and 3)between the terminal T12 and the insulated circuit C20. The externalpower source connection terminal T30 is provided for acquiringelectrical power from the external power source to drive the solenoidprovided in the field device 11 b. The field device 11 b is connected tothe connection terminals TA and TB. Therefore, it may be said that theinsulated circuit C20 provided in the option module M1 shown in FIG. 4Bis for enabling the transmitting and receiving of the signals betweenthe field device 11 b and the connection lines L1 and L2 whileelectrically insulating the connection between the field device 11 b andthe connection lines L1 and L2.

Depending on the types of field devices 11 connected to the optionmodule M1, there are still option modules M1, which do not include amicroprocessor, other than the option module M1 shown in FIGS. 4A and4B. For example, there is an option module including a circuit forprocessing signals transmitted and received between the terminal T11 andthe terminal T21 and signals transmitted and received between theterminal T12 and the terminal T22. The circuit is, for example, anamplifier and is for amplifying the voltage or electrical current ofanalog signal or for attenuating the voltage or electrical current. Ifthe signals are discrete signals, the circuit is for amplifying thevoltage or electrical current of discrete signal or for attenuating thevoltage or electrical current. The option module M1 may have aconstitution, which does not include the insulated circuit such as aphotcoupler or a trance insulating the connection between the fielddevice 11 and the universal I/O module M2 and includes only a circuitfor performing signal processing such as amplification and attenuation.

The option module M1 shown in FIG. 5A is one, to which a field device(transmitter) 11 c for performing a communication in compliance with anindustrial communication standard such as HART (registered trademark)and Foundation Fieldbus (registered trademark) is connected. A circuitC30, which includes a microprocessor C31 and insulated circuits C32 andC33, and a system power source connection terminal T40 are provided inthe option module M1 shown in FIG. 5A.

The microprocessor C31 is connected to the terminals T11 to T14 and theinsulated circuits C32 and C33. The microprocessor C31 performs aconversion process of communication protocol or the like for signalsinput from the terminals T11 and T12 (the signals from the field device11 c), and outputs the processed signals to the insulated circuit C32.The conversion process of communication protocol performed by themicroprocessor C31 converts a communication protocol for communicatingwith the field device 11 c into a communication protocol forcommunicating with the signal processing circuit 22 via thecommunication bus SB (refer to FIG. 6; the details of the signalprocessing circuit 22 will be described later), and vice versa.

The insulated circuit C32 includes, for example, a photocoupler. Theinsulated circuit C32 is a communication circuit which enables thetransmitting and receiving of signals between the microprocessor C31 andthe terminal T24 while electrically insulating the connection betweenthe microprocessor C31 and the terminal T24. The insulated circuit C33includes, for example, a trance, and is connected to the microprocessorC31 and the system power source connection terminal T40. The insulatedcircuit C33 is a DC/DC conversion circuit which converts the sourcevoltage of system power source connected to the system power sourceconnection terminal T40 (the system power source connected to the systempower source connection terminal T4 shown in FIGS. 2 and 3) into asource voltage suitable for the microprocessor C31 while electricallyinsulating the connection between the microprocessor C31 and the systempower source connection terminal T40.

The field device 11 c is connected to the connection terminals TA andTB. Therefore, it may be said that the circuit C30 provided in theoption module M1 shown in FIG. 5A is for performing the conversionprocess of communication protocol for the signals from the field device11 c and transmitting the processed signals to the communication bus SBwhile electrically insulating the connection between the field device 11c and the communication bus SB. The option module M1 shown in FIG. 5Aperforms the transmitting and receiving of the signals via thecommunication bus SB, but does not perform the transmitting andreceiving of the signals via the connection lines L1 and L2.

The option module M1 shown in FIG. 5B is one, to which a thermocouplesensor 11 d and a RJC (Reference Junction Compensation) 15 areconnected. As with the case of the option module M1 shown in FIG. 5A, acircuit C30, which includes a microprocessor C31 and insulated circuitsC32 and C33, and a system power source connection terminal T40 areprovided in the option module M1 shown in FIG. 5B. The option module M1shown in FIG. 5B may be different from that shown in FIG. 5A in aprocess performed by the microprocessor C31 as described hereinafter.

The microprocessor C31 is connected to terminals T11 to T14 andinsulated circuits C32 and C33. The microprocessor C31 performs ananalog-to-digital conversion process, a compensation process, andamplification process, and the like for signals input from the terminalsT11 and T12 (the signals from the thermocouple sensor 11 d), and outputsthe processed signals to the insulated circuit C32. The microprocessorC31 performs the compensation process for compensating the signals fromthe thermocouple sensor 11 d (temperature compensation) using signalsfrom RJC 15 (the signals indicating the temperature around thethermocouple sensor 11 d). The microprocessor C31 converts the signals,which have been subjected to the above-stated various processes, intosignals, which are communicatable via the communication bus SB, andoutputs the converted signals to the insulated circuit C32. Theinsulated circuits C32 and C33 are the same as the insulated circuitsC32 and C33 shown in FIG. 5A, respectively.

The thermocouple sensor 11 d is connected to connection terminals TA andTB. The RJC 15 is connected to connection terminals TC and TD.Therefore, it may be said that the circuit C30 provided in the optionmodule M1 shown in FIG. 5B is for performing the compensation(temperature compensation) for the signals from the thermocouple sensor11 d and transmitting the compensated signals to the communication busSB while electrically insulating the connection between the thermocouplesensor 11 d and the communication bus SB. As with the case of the optionmodule M1 shown in FIG. 5A, the option module M1 shown in FIG. 5Bperforms the transmitting and receiving of the signals via thecommunication bus SB, but does not perform the transmitting andreceiving of the signals via the connection lines L1 and L2.

A universal I/O module M2 is detachably provided in a universal-slot SL2provided in a base plate BP. The universal I/O module M2 is forperforming a pre-determined process for signals input and output via theoption module M1. The universal I/O module M2 has a cuboid shape and agreater external dimension than that of the option module M1.

The two universal I/O modules M2 attached to the base plate BP are sameeach other. Allowing the two universal I/O modules M2 to be attached tothe base plate BP makes the universal I/O module M2 redundant andenhances the reliability. Contrary to the option module M1 which variesbased on the types of the field devices 11, the universal I/O module M2is constant regardless of the types of the field devices 11. Therefore,the universal I/O module M2 is not detached or changed except when theuniversal I/O module M2 fails, or the like.

FIG. 6 is a block diagram showing the internal constitution of auniversal I/O module used for the I/O module according to the embodimentof the present invention. As shown in FIG. 6, the universal I/O moduleM2 includes a plurality of universal circuits 21 and a signal processingcircuit 22. The universal circuit 21 is capable of performing input andoutput of signals, which are input into and output from the field device11. The field device 11 is connected to the universal circuit 21 via theoption module M1.

Specifically, the universal circuit 21 is capable of performing theinput of the analog signal from the field device 11, the output of theanalog signal to the field device 11, the input of the discrete signalfrom the field device 11, and the output of the discrete signal to thefield device 11. The process which the universal circuit 21 performsamong the inputs and the outputs described above is pre-determined by,for example, the control of the controller 13. The universal circuit 21is capable of selecting and performing any one of the inputs and theoutputs described above.

The universal circuit 21 is provided so that the universal circuit 21corresponds to the option slot SL1 provided in the base plate BP. Inother words, the universal circuit 21 is provided so that the universalcircuit 21 corresponds a connection terminal T1 (the connection terminalT1 indicates the set of four connection terminals TA, TB, TC, and TDshown in FIGS. 4A, 4B, 5A and 5B), which corresponds to the option slotSL1. Each universal circuit 21 is connected to the corresponding optionslot SL1 via a pair of signal lines L1 and L2, and the signal processingcircuit 22.

The signal processing circuit 22 is connected to the plurality ofuniversal circuits 21, and the status line ST and the communication busSB, which are connected to each option slot SL1. The signal processingcircuit 22 processes signals transmitted to and received from the fielddevice 11 via the universal circuit 21 or the communication bus SB. Inaddition, the signal processing circuit 22 communicates with thecontroller 13 to transmit signals from the field device 11 to thecontroller 13 and to receive signals for the field device 11, which aretransmitted from the controller 13.

In addition, the signal processing circuit 22 identifies the type of theoption module M1 attached to the option slot SL1. The signal processingcircuit 22 identifies the type of the option module M1 attached to eachoption slot SL1 based on the voltage at the status line ST connected toeach option slot SL1.

As described above, the identification resistance R provided in eachoption slot M1 is connected to the status line ST. Therefore, forexample, when constant electrical current flows through theidentification resistance R, a voltage drop depending on the resistancevalue of the identification resistance R occurs in the identificationresistance R, the voltage drop appears at the status line ST. Thereby,the signal processing circuit 22 identifies the type of the optionmodule M1 attached to the option slot SL1 based on the voltage at thestatus line ST. The identification results obtained from the signalprocessing circuit 22 are transmitted to the controller 13.

[Operations of I/O Module]

Next, the operations of the I/O module 12 described above will bedescribed. Hereinafter, an example of operation in which control signals(analog signals, or discrete signals) for operating the valve device 11a shown in FIG. 4A as the field device 11 are transmitted from thecontroller 13 to the valve device 11 a, and an example of operation inwhich signals (discrete signals) from the field device 11 c shown inFIG. 5A are transmitted to the controller 13, will be described.

When the control signals for operating the valve device 11 a shown inFIG. 4A is output from the controller 13, the control signals arereceived by the signal processing circuit 22 provided in the universalI/O module M2, and then, the control signals is output to any one of theuniversal circuits 21 (the universal circuit 21 corresponds to theconnection terminal T1, to which the valve device 11 a is connected).The universal circuit 21 is previously set by the control of thecontroller 13 so that the output of the control signals (analog signalsor discrete signals) is possible.

The control signals output from the universal circuit 21 passes througha pair of signal lines L1 and L2, and then, are input to the optionmodule M1 via the terminals T21 and T22. Then, the control signals areoutput from the terminals T11 and T12 to the outside of the optionmodule M1 via a circuit C10 (the circuit including two connection lines)provided in the option module M1, and then, are input into the valvedevice 11 a via the terminal T1 (the connection terminals TA and TB).

As described above, in the example shown in FIG. 4A, the connectionterminal T1 (the connection terminals TA and TB), to which the valvedevice 11 a as the field device 11 is connected, and the universalcircuit 21, which corresponds to the connection terminal T1, areelectrically connected by the circuit C10 provided in the option moduleM1. Therefore, the control signals for the valve device 11 a output fromthe universal circuit 21 merely pass through the option module M1, andthen, are input to the valve device 11 a.

When the discrete signals are output from the field device 11 c shown inFIG. 5A, first, the discrete signals are input to the connectionterminal T1 (the connection terminals TA and TB) provided in the baseplate BP. The discrete signals input to the connection terminals TA andTB are input to the option module M1 shown in FIG. 5A via the terminalsT11 and T12, subjected to a protocol conversion process and the like bythe microprocessor C31 provided in the option module M1, and then,output to the outside of option module M1 via the insulated circuit C32and the terminal T24 in this order.

The communication bus SB is connected to the terminal T24 of the optionmodule M1. Therefore, the signals output to the outside of option moduleM1 are input to the universal I/O module M2 via the communication busSB, and then, are input into the signal processing circuit 22 withoutbeing input to the universal circuit 21. After the pre-determinedprocess (for example, a protocol conversion process for transmitting thediscrete signals to the controller 13) is performed for the discretesignals input to the signal processing circuit 22, the processed signalsare transmitted to the controller 13.

As described above, in the example shown in FIG. 5A, the connectionterminal T1 (the connection terminals TA and TB) to which the fielddevice 11 c is connected and the communication bus SB are electricallyconnected by the circuit C30 provided in the option module M1.Therefore, the discrete signals output from the field device 11 c aresubjected to the conversion process of communication protocol by theoption module M1, and then, input to the signal processing circuit 22provided in the universal I/O module M2 via the communication bus SB.Then, the input signals are subjected to a pre-determined signal processby the signal processing circuit 22, and transmitted to the controller13.

As described above, in the present embodiment, the universal I/O moduleM2, which includes the plurality of the universal circuits 21 and thesignal processing circuit 22, and the option module M1 for connectingthe field device 11 to the universal I/O module M2 are detachablyprovided in the base plate BP including the plurality of connectionterminals T1, to which the field device 11 is connected. Therefore, whenthe option module M1 depending on the field device 11 connected to theconnection terminal T1 of the base plate BP is attached to the baseplate BP, the field device 11 can be connected to the universal circuit21 or the signal processing circuit 22 provided in the universal I/Omodule M2. Therefore, in the present embodiment, a greater variety offield devices than ever before can be connected.

In addition, in the present embodiment, the connection line forconnecting the plurality of connection terminals T1, the option moduleM1 (option slot SL1), and the universal I/O module M2 (universal-slotSL2) is formed in the base plate BP. Therefore, since an operation forconnecting them using connection lines and an operation for changingconnection lines are unnecessary, maintenance is easy.

In addition, in the present embodiment, the signal processing circuit 22provided in the universal I/O module M2 can identify the type of theoption module M1 attached to the base plate BP based on the voltage ofthe identification resistance R via the status line ST, and transmit theidentification results to the controller 13. Therefore, the installationstate of the option module M1 can be understood without making anoperator go to the site where the I/O module 12 is installed, thereby,the maintenance efficiency of the I/O module 12 can be enhanced.

[Variation of I/O Module]

FIG. 7 is a block diagram simply showing a variation of the I/O moduleaccording to the embodiment of the present invention. In FIG. 7, blocksthat correspond to those in FIGS. 4A, 4B, 5A and 5B are assigned thesame reference numerals. The option modules M1 used for the I/O module12 described in the above-stated embodiment include one option module inwhich a microprocessor is not installed and the field device 11 isconnected to the universal circuit 21 (refer to FIGS. 4A and 4B), andanother one in which a microprocessor is installed and the field device11 is connected to the signal processing circuit 22 via thecommunication bus SB (refer to FIGS. 5A and 5B).

On the other hand, an option module M1 used for an I/O module 12 shownin FIG. 7 includes, so to speak, both the function of the option moduleM1 shown in FIGS. 4A and 4B and the function of the option module M1shown in FIGS. 5A and 5B. In other words, in the option module M1 shownin FIG. 7, a microprocessor C31 is installed, the field device 11 isconnected to the signal processing circuit 22 via the communication busSB, and the field device 11 is connected to the universal circuit 21.

As shown in FIG. 7, the option module M1 used for the variationincludes, for example, the circuit C10 shown in FIG. 4A and themicroprocessor C31 shown in FIG. 5A. The insulated circuits C32 and C33shown in FIG. 5A are omitted from FIG. 7. The option module M1 havingsuch constitution enables the field device 11 configured to perform ahybrid communication such as HART (registered trademark) to beconnected. The hybrid communication indicates a communication method inwhich analog signals and discrete signals can be communicatedsimultaneously by superimposing the discrete signals on the analogsignals.

In other words, the option module M1 shown in FIG. 7 outputs the analogsignals in the hybrid communication to the universal circuit 21 via thecircuit C10, processes the discrete signals superimposed on the analogsignals using the microprocessor C31 (for example, protocol conversionprocess), and transmits the processed signals the signal processingcircuit 22 via the communication bus SB. Using such option module M1, itis unnecessary to provide an extra circuit (for example, a dividingcircuit for dividing analog signals and discrete signals) in theuniversal I/O module M2, thereby, the universal I/O module M2 can besimplified. In addition, as the adventitious effect according to thepresent constitution, the load of the signal processing circuit 22 canbe reduced by adding the circuit of the microprocessor C31.

When the dividing circuit or the like is provided in the universal I/Omodule M2 and the communication protocol used for the field device 11varies based on the replacement of the field device 11 or the update ofthe field device 11, it is necessary to replace both the universal I/Omodule M2 and the option module M1. However, in the constitution shownin FIG. 7, it is unnecessary to replace the universal I/O module M2 andit is only necessary to replace the option module M1, or to change theprogram used in the microprocessor C31 of the option module M1, or thelike.

The option module M1 having the constitution shown in FIG. 7 canidentify the type of the field device 11 connected to the option moduleM1 by making the microprocessor C31 interpret signals (communicationsignals superimposed on analog signals) from the field device 11. Bytransmitting the identification results obtained from the microprocessorC31 to the controller 13 via the communication bus SB and the signalprocessing circuit 22, it is possible to automatically set the input andoutput operations of the universal circuit 21, to which the field device11 is connected.

[Another Variations]

FIG. 8 is a diagram simply showing another variation of the I/O moduleaccording to the embodiment of the present invention. As shown in FIG.8, in the present variation, two identical option modules M1 areprovided in parallel with respect to one field device 11 to make theoption module M1 redundant. The two option modules M1 are attached tothe base plate BP using the two option slots SL1 shown in FIG. 2. Asdescribed above, by making the option module M1 redundant, which isdirectly connected to the field device 11 and has a high failure risk,the reliability of the process control system 1 can be enhanced and theincrease of the availability ratio of the process control system 1 canbe expected. The parallel number of the option modules M1 may be equalto or greater than three.

As the communication bus SB for connecting the option slot SL1 (optionmodule M1) and the universal-slot SL2 (universal I/O module M2), a buslaid on a plant where the process control system 1 shown in FIG. 1 isconstructed, or the like, may be used. When, for example, thecommunication bus SB is in compliance with Foundation Fieldbus(registered trademark), the protocol conversion process performed by themicroprocessor C31 (refer to FIGS. 5A and 5B) may be omitted.

Although the foregoing has been a description of the I/O moduleaccording to one embodiment of the present invention, the presentinvention is not limited to the embodiment described above, and can befreely modified within the scope of the present invention. For example,in the embodiment described above, the example in which the plurality ofuniversal circuits 21 and the signal processing circuit 22 are providedin the universal I/O module M2 and the universal I/O module M2 isdetachably provided in the base plate BP was described. However, theuniversal circuit 21 may be provided in the base plate BP, and only thesignal processing circuit 22 may be detachably provided. Alternatively,both the universal circuit 21 and the signal processing circuit 22 maybe provided in the base plate BP.

1-20. (canceled)
 21. An input/output (I/O) module, comprising: a baseplate comprising a plurality of connection terminals, the connectionterminals being electrically connectable to a plurality of fielddevices; a plurality of universal circuits associated with theconnection terminals, the universal circuits being provided on the baseplate, and each of the plurality of universal circuits being configuredto receive analog signals from respective one of the plurality of fielddevices, to output analog signals to the respective one of the pluralityof field devices, to receive discrete signals from the respective one ofthe plurality of field devices, and to output discrete signals to therespective one of the plurality of field devices; and a plurality ofoption modules detachably provided on the base plate, each of the optionmodules being provided between respective one of the connectionterminals and respective one of the universal circuits, the respectiveone of the connection terminals being associated with the respective oneof the universal circuits, and each of the option modules comprising afirst circuit configured to perform transmitting of signals between therespective one of the connection terminals and the respective one of theuniversal circuits.
 22. The I/O module according to claim 21, whereinthe plurality of option modules comprise a first option module, and atleast one of a second option module and a third option module, the firstoption module comprising the first circuit which comprises a connectionline electrically connecting the respective one of the connectionterminals and the respective one of the universal circuits, the secondoption module comprising the first circuit which is configured toconnect the respective one of the connection terminals and therespective one of the universal circuits to enable transmitting ofsignals between the respective one of the connection terminals and therespective one of the universal circuits while electrically insulating aconnection between the respective one of the connection terminals andthe respective one of the universal circuits, the third option modulecomprising the first circuit which is configured to amplify or attenuatesignals transmitted between the respective one of the connectionterminals and the respective one of the universal circuits; and whereinone of the first option module, and at least one of the second optionmodule and the third option module is attached to the base platedepending on respective one of the plurality of field devices.
 23. TheI/O module according to claim 21, wherein each of the option modulescomprises the first circuit depending on a type of respective one of theplurality of field devices connected via respective one of theconnection terminals.
 24. The I/O module according to claim 21, whereinthe first circuit comprises a connection line electrically connectingthe respective one of the connection terminals and the respective one ofthe universal circuits.
 25. The I/O module according to claim 21,wherein the first circuit is configured to connect the respective one ofthe connection terminals and the respective one of the universalcircuits to enable transmitting of signals between the respective one ofthe connection terminals and the respective one of the universalcircuits while electrically insulating a connection between therespective one of the connection terminals and the respective one of theuniversal circuits.
 26. The I/O module according to claim 25, whereinthe first circuit comprises a photocoupler.
 27. The I/O module accordingto claim 21, wherein the first circuit is configured to amplify orattenuate signals transmitted between the respective one of theconnection terminals and the respective one of the universal circuits.28. The I/O module according to claim 21, further comprising: a signalprocessing circuit provided on the base plate, connected to theuniversal circuits, and configured to process signals transmitted to orreceived from the plurality of field devices, wherein each of the optionmodules is connected to the respective one of the universal circuits andthe signal processing circuit.
 29. The I/O module according to claim 28,further comprising: a communication bus provided on the base plate andconfigured to connect each of the option modules attached to the baseplate and the signal processing circuit, wherein at least one of theoption modules is connected to the signal processing circuit via thecommunication bus; and wherein the first circuit of the at least one ofthe option modules is configured to communicate with the signalprocessing circuit via the communication bus.
 30. The I/O moduleaccording to claim 28, further comprising: a communication bus providedon the base plate and configured to connect each of the option modulesattached to the base plate and the signal processing circuit, whereinthe plurality of option modules comprise a first option module and afourth option module, the first option module comprising the firstcircuit which comprises a connection line electrically connecting therespective one of the connection terminals and the respective one of theuniversal circuits, the fourth option module comprising the firstcircuit which is configured to communicate with the signal processingcircuit via the communication bus; and wherein one of the first optionmodule and the fourth option module is attached to the base platedepending on respective one of the plurality of field devices.
 31. TheI/O module according to claim 21, wherein the universal circuits areinstalled on an universal-I/O module detachably provided on the baseplate.
 32. The I/O module according to claim 28, wherein the signalprocessing circuit and the universal circuits are installed on anuniversal-I/O module detachably provided on the base plate.
 33. The I/Omodule according to claim 21, wherein at least two of the option modulesattached to the base plate are the same as each other, and the at leasttwo option modules are connected to one of the field devices to make theoption modules redundant.
 34. The I/O module according to claim 29,wherein the first circuit comprises a first insulated circuit, a secondinsulated circuit, and a microprocessor connected to the connectionterminals and the first and second insulated circuits.
 35. The I/Omodule according to claim 34, wherein the first insulated circuit isconfigured to connect the microprocessor and the signal processingcircuit to enable transmitting of signals between the microprocessor andthe signal processing circuit while electrically insulating a connectionbetween the microprocessor and the signal processing circuit.
 36. TheI/O module according to claim 34, wherein the second insulated circuitis configured to convert a source voltage of system power source into asource voltage suitable for the microprocessor while electricallyinsulating a connection between the microprocessor and the system powersource.
 37. The I/O module according to claim 35, wherein themicroprocessor is configured to perform a conversion process ofcommunication protocol for signals input from each of the field devicesvia respective one of the connection terminals, or to output theprocessed signals to the first insulated circuit.
 38. The I/O moduleaccording to claim 35, wherein the microprocessor is configured toperform at least one of an analog-to-digital conversion process, acompensation process, and an amplification process for signals inputfrom each of the field devices via respective one of the connectionterminals, and to output the processed signals into the first insulatedcircuit.
 39. An input/output (I/O) module, comprising: a base platecomprising a plurality of connection terminals, the connection terminalsbeing electrically connectable to a plurality of field devices; aplurality of universal circuits associated with the connection terminalsand each of the plurality of universal circuits being configured toreceive analog signals from respective one of the plurality of fielddevices, to output analog signals to the respective one of the pluralityof field devices, to receive discrete signals from the respective one ofthe plurality of field devices, and to output discrete signals to therespective one of the plurality of field devices; and a plurality ofoption modules detachably provided on the base plate, each of the optionmodules being provided between respective one of the connectionterminals and respective one of the universal circuits, the respectiveone of the connection terminals being associated with the respective oneof the universal circuits, and each of the option modules comprising afirst circuit configured to perform transmitting of signals between therespective one of the connection terminals and the respective one of theuniversal circuits.
 40. The I/O module according to claim 39, whereinthe plurality of option modules comprise a first option module, and atleast one of a second option module and a third option module, the firstoption module comprising the first circuit which comprises a connectionline electrically connecting the respective one of the connectionterminals and the respective one of the universal circuits, the secondoption module comprising the first circuit which is configured toconnect the respective one of the connection terminals and therespective one of the universal circuits to enable transmitting ofsignals between the respective one of the connection terminals and therespective one of the universal circuits while electrically insulating aconnection between the respective one of the connection terminals andthe respective one of the universal circuits, the third option modulecomprising the first circuit which is configured to amplify or attenuatesignals transmitted between the respective one of the connectionterminals and the respective one of the universal circuits; and whereinone of the first option module, and at least one of the second optionmodule and the third option module is attached to the base platedepending on respective one of the plurality of field devices.
 41. TheI/O module according to claim 39, wherein each of the option modulescomprises the first circuit depending on a type of respective one of theplurality of field devices connected via respective one of theconnection terminals.
 42. The I/O module according to claim 39, furthercomprising: a signal processing circuit connected to the universalcircuits, and configured to process signals transmitted to or receivedfrom the plurality of field devices; and a communication bus provided onthe base plate and configured to connect each of the option modulesattached to the base plate and the signal processing circuit, whereineach of the option modules is connected to the respective one of theuniversal circuits and the signal processing circuit; wherein theplurality of option modules comprise a first option module and a fourthoption module, the first option module comprising the first circuitwhich comprises a connection line electrically connecting the respectiveone of the connection terminals and the respective one of the universalcircuits the fourth option module comprising the first circuit which isconfigured to communicate with the signal processing circuit via thecommunication bus; and wherein one of the first option module and thefourth option module is attached to the base plate depending onrespective one of the plurality of field devices.
 43. An input/output(I/O) module, comprising: a base plate; a plurality of universalcircuits, each of the plurality of universal circuits being associatedwith respective one of a plurality of field devices, each of theplurality of universal circuits being configured to receive signals fromthe respective one of the plurality of field devices and to outputsignals to the respective one of the plurality of field devices; and aplurality of option modules detachably provided on the base plate, eachof the plurality of option modules being provided between respective oneof the plurality of field devices and respective one of the plurality ofuniversal circuits and comprising a first circuit configured to performtransmitting of signals between the respective one of the plurality offield devices and the respective one of the plurality of universalcircuits.
 44. The I/O module according to claim 43, wherein theplurality of option modules comprise a first option module, and at leastone of a second option module and a third option module, the firstoption module comprising the first circuit which comprises a connectionline electrically connecting the respective one of the plurality offield devices and the respective one of the universal circuits, thesecond option module comprising the first circuit which is configured toconnect the respective one of the plurality of field devices and therespective one of the universal circuits to enable transmitting ofsignals between the respective one of the plurality of field devices andthe respective one of the universal circuits while electricallyinsulating a connection between the respective one of the plurality offield devices and the respective one of the universal circuits, thethird option module comprising the first circuit which is configured toamplify or attenuate signals transmitted between the respective one ofthe plurality of field devices and the respective one of the universalcircuits; and wherein one of the first option module, the second optionmodule, and the third option module is attached to the base platedepending on respective one of the plurality of field devices.
 45. TheI/O module according to claim 43, wherein each of the option modulescomprises the first circuit depending on a type of respective one of theplurality of field devices.
 46. The I/O module according to claim 43,further comprising: a signal processing circuit connected to theuniversal circuits, and configured to process signals transmitted to orreceived from the plurality of field devices; and a communication busprovided on the base plate and configured to connect each of the optionmodules attached to the base plate and the signal processing circuit,wherein each of the option modules is connected to the respective one ofthe universal circuits and the signal processing circuit; wherein theplurality of option modules comprise a first option module and a fourthoption module, the first option module comprising the first circuitwhich comprises a connection line electrically connecting the respectiveone of the plurality of field devices and the respective one of theuniversal circuits, the fourth option module comprising the firstcircuit which is configured to communicate with the signal processingcircuit via the communication bus; and wherein one of the first optionmodule and the fourth option module is attached to the base platedepending on respective one of the plurality of field devices.
 47. Aprocess control system, comprising an input/output (I/O) moduleaccording to claim
 43. 48. An input/output (I/O) module, comprising: abase plate comprising a plurality of connection terminals, theconnection terminals being electrically connectable to a plurality offield devices; a plurality of universal circuits associated with theconnection terminals and each of the plurality of universal circuitsbeing configured to receive signals from respective one of the pluralityof field devices, and to output signals to the respective one of theplurality of field devices; and a plurality of option modules detachablyprovided on the base plate, each of the option modules being providedbetween respective one of the connection terminals and respective one ofthe universal circuits, the respective one of the connection terminalsbeing associated with the respective one of the universal circuits, andeach of the option modules comprising a first circuit configured toperform transmitting of signals between the respective one of theconnection terminals and the respective one of the universal circuits.49. The I/O module according to claim 48, wherein the universal circuitsbeing provided on the base plate.
 50. The I/O module according to claim21, wherein each of the universal circuits is associated with acorresponding one of the connection terminals.
 51. The I/O moduleaccording to claim 39, wherein each of the universal circuits isassociated with a corresponding one of the connection terminals.
 52. TheI/O module according to claim 48, wherein each of the universal circuitsis associated with a corresponding one of the connection terminals. 53.The I/O module according to claim 21, wherein each of the option modulescomprises: a first connection terminal connected to the respective oneof the connection terminals; and a second connection terminal connectedto the respective one of the universal circuits associated with therespective one of the connection terminals.
 54. The I/O module accordingto claim 39, wherein each of the option modules comprises: a firstconnection terminal connected to the respective one of the connectionterminals; and a second connection terminal connected to the respectiveone of the universal circuits associated with the respective one of theconnection terminals.
 55. The I/O module according to claim 43, whereineach of the option modules comprises: a first connection terminalconnected to the respective one of the field devices; and a secondconnection terminal connected to the respective one of the universalcircuits associated with the respective one of the field devices. 56.The I/O module according to claim 48, wherein each of the option modulescomprises: a first connection terminal connected to the respective oneof the connection terminals; and a second connection terminal connectedto the respective one of the universal circuits associated with therespective one of the connection terminals.
 57. The I/O module accordingto claim 21, wherein each of the option modules is a hardware device.58. The I/O module according to claim 39, wherein each of the optionmodules is a hardware device.
 59. The I/O module according to claim 43,wherein each of the option modules is a hardware device.
 60. The I/Omodule according to claim 48, wherein each of the option modules is ahardware device.